TECHNOLOGY OF FORMATION OF THICK COPPER LAYERS ON CERAMIC SUBSTRATES WITH HIGH THERMAL CONDUCTIVITY
Methods of formation of copper layers on ceramics for power electronics circuits are considered. Research of key parameters of the ceramic-metal substrates metallized on technology of direct bonding of copper with ceramics is carried out. Features of this metallization technology on the example of ceramic-metal substrates of foreign production from the «CETEC» company are revealed.
Authors: I. B. Krasniy
Direction: Physical Electronics and Technologies of Micro- and Nanostructures
Keywords: Power semiconductor devices, ceramic with high thermal conductivity, direct bonded copper
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