PLACING VIAS IN THE FIELD BGA COMPONENT
The technique destination through vias in BGA-components when in the same area, but on the other side of the PCB, "the blocking" of the two contact devices. Method takes into account the actual size of the holes and minimizes the length of section of wire from the contacts to the corresponding transitions, and used in CAD "TopoR".
Authors: A. V. Bessonov, K. A. Knop, Yu. T. Lyachek
Direction: Informatics, management and Computer Technology
Keywords: Tracing, PCB, BGA-component, the combination of pairs
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