Modeling of the substrate heating kinetics during sputtering of a copper-titanium sandwich target

This study focuses on the special aspects of the heat flow formation during the sputtering of a sandwich target with an internal copper plate and an external titanium one in argon. The kinetics of the heat flow generated by the external plate was determined by the numerical solution of the two-dimensional uniform Fourier’s equation with a set of boundary and zero initial conditions. The Heat Transfer Module of the COMSOL Multiphysics software was used for numerical calculations. In calculations, the grid element size was chosen to be 3.64 mm, which ensures a calculation error of ≤ 5 %. Solving the Fourier’s equation in the time range of 0…500 s with a step of 1 s resulted in a set of the surface temperature distributions of the external plate. When studying heat flows, the external plate was presented as a set of concentric radiation sources with a constant surface temperature. The central source had the shape of a disk, all the others were ring-shaped. The geometric dimensions of the sources and their temperatures were determined by solving the problem of stepwise approximation of the external plate’s surface temperature distribution with a relative error of 10 %. This article provides calculation results for power of 1,000 W and total relative area of the cutouts of 0.25. The comparison of calculated and experimental data is presented.

Authors: V. I. Shapovalov, D. S. Sharkovskii

Direction: Physics

Keywords: magnetron sputtering, sandwich target, heat flow

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