IGBT MODULES FAILURE MECHANISMS DURING POWER CYCLING TEST

Investigates the main failure mechanisms of the components and interfaces of the soldered power IGBT modules during power cycling test. The authors present classifications and schemes of the appearance and development of degradation mechanisms of components in soldered power IGBT modules, including the causes of their occurrence and detection indi-cators. An experiment was prepared and carried out to study the influence of the cycling mode on the structural elements degradation of IGBT modules prototypes. Based on the test results in the short and long power cycling mode, the de-pendences of the collector-emitter saturation voltage on the number of cycles are plotted. The novelty of the paper lies in these dependences, allowing to determine the dominant degradation mechanism of the investigated device in the absence of data on the mode of its testing or operation without the need for additional diagnostic measures. Soldered IGBT

Authors: V. V. Verevkin, K. A. Volobuev, S. L. Strigunov, A. P. Pilipenko, V. A. Lobanova

Direction: Electrical Engineering

Keywords: Soldered IGBT power modules, reliability tests, failure mechanisms, power cycling test, solder fatigue, bond wire fatigue, chip surface reconstruction, substrate delamination

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