DIE-CASE THERMAL RESISTANCE OF ICs AND SEMICONDUCTOR DEVICES MEASUREMENTS WITH THERMAL IMAGE CAMERA

The method for determining die-case thermal resistance for ICs and semiconductor device’s based on obtaining thermal images of die decapsulated still in its package at stabilized case temperature is realized. For the two samples of 1658РУ1У memory ICs die-case thermal resistance values equal to 4.4 and 4.8 °С/W have been obtained. Advantages and disadvantages of of this method are analyzed.

Authors: I. A. Martynov

Direction: Physical Electronics and Technologies of Micro- and Nanostructures

Keywords: Thermal resistance, thermal image, thermal image camera, PID-control, memory IC

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